Classification of PCB Aluminum Base Clad

PCB Aluminum Base Clads are typically divided into three categories:

1. Common Type Aluminum Clad

This type of aluminum clad features an insulating layer made of epoxy fiber glass sheet. It is widely used due to its balance of performance and cost.

2. High Heat Radiation Aluminum Clad

In this category, the insulating layer is made from a high thermally conductive epoxy fiber glass or other resin materials. These aluminum clads are designed for applications requiring excellent heat dissipation.

3. High-Frequency Aluminum Clad

For high-frequency applications, the insulating layer is made of polyolefin resin or polyimide resin, constituting fiber glass. These materials provide the necessary properties for managing high-frequency signals effectively.

Key Differences Between Aluminum Clad and FR-4 CCL

One of the primary differences between Aluminum Clad and FR-4 Copper Clad Laminates (CCL) is their thermal performance. For example, a 1.5mm thick FR-4 Copper Clad has a thermal resistance of approximately 20 to 25°C/W, whereas a 1.5mm thick aluminum clad exhibits a much lower thermal resistance of about 1.0 to 2.5°C/W. This significant difference makes aluminum clads more suitable for applications where efficient heat dissipation is crucial.