Material

PCB manufacturing involves advanced technologies that improve component sizes, track reduction, and board reliability. Several factors influence the cost of PCBs, such as material quality, number of layers, surface finish, delivery time, board size, process technology, and production standards. Material costs vary based on quality and tolerance requirements, while adding more layers increases production complexity and cost. Surface finishes like immersion gold (ENIG) are more expensive due to longer production times and higher material costs. Delivery time also affects pricing, with faster turnaround times incurring higher costs. Specific manufacturing requirements, such as compliance with IPC Class 3 standards or special board outlines, can further increase the price. Read More

This article introduces the design specifications and types of PCB shielding cases, focusing on material selection, heat dissipation design, batch soldering, maintenance methods, and cost considerations. Three main soldering forms are proposed: single piece soldering, detachable two-piece soldering, and shielding case clip + single shielding case. It emphasizes the importance of selecting the appropriate design scheme based on actual application scenarios. Read More