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SMT Reflow Profile
The SMT reflow soldering process includes pre-heat, soak, reflow, and cooling zones. The pre-heat zone gradually heats up to about 150°C to evaporate moisture and activate the flux in the solder paste. The soak zone maintains a temperature of 150±10°C to remove volatiles and uniformly heat components. The reflow zone, the hottest area, melts the solder paste and forms intermetallic compounds. The cooling zone controls the cooling rate to prevent component damage. Precise control of temperature and time in each zone is crucial for ensuring soldering quality. Read More

Heating rate

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